Oxygen free Copper

Oxygen-free copper grains have a high Copper purity level (99.99% minimum) and Oxygen content of less than 10ppm. It has a clean surface specifically for electroplating purposes and are used for Alkaline Plating process in the cyanide and pyrophosphate bath. Because of it’s fine grain structure the plating layer is even and this results in lower optimal consumption of Copper anode. The sludge formation is minimum thus reducing the frequency of bath cleaning and savings costs